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Definition
Thermal Grease, also known as thermal paste, is a thermally conductive material in paste form applied between a heat source (such as a CPU, GPU, or power transistor) and a heat sink. Its primary purpose is to fill microscopic gaps between the two contact surfaces, thereby reducing thermal resistance and enhancing heat transfer efficiency.
It is typically a non-curing material that retains a soft consistency, allowing for the formation of an ultra-thin interface layer between the component and the heat sink.

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Structure and Composition
Fundamentally, Thermal Grease typically consists of two main components: a base fluid and thermally conductive fillers.
- Based fluid/polymer matrix: usually silicone oil or a silicone polymer.
- Thermally conductive fillers: dispersed within the base medium to enhance heat transfer capabilities.
Fillers can be selected to meet specific requirements depending on the application (e.g., thermally conductive yet electrically insulating, or both thermally and electrically conductive).
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Characteristics
– Good thermal conductivity
– Does not require significant thickness; a thin layer suffices to fill microscopic gaps.
– High viscosity, allowing the material to adhere to the surface and minimizing flow.
– Thermal stability: must withstand high temperatures for extended periods.
– Electrical conductivity: ranges from fully electrically insulating to metal-containing types that conduct electricity and require careful handling.
– Resistance to running or oil separation.
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Applications
This product is widely used in electronic and power electronics systems:
– Computer: CPUs, GPUs, and power components.
– Power electronics: transistors, MOSFETs, IGBTs, and power modules.
– LED: enhancing heat transfer from the LED to the heatsink.
– Industrial equipment: power supplies, inverters, and electronic modules requiring heat dissipation.
– Consumer electronics: gaming consoles, laptops, and devices with high-performance processors.
Thermal Grease is not a substitute for a heatsink. Its primary function is to optimize thermal contact between the component and the heatsink, thereby ensuring stable operation and preventing overheating.
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